Substrat | FR4/Tinggi TG FR-4/M4/M6/Rogers/Nelco/Isola |
Ketebalan papan | 0.2 - 4mm |
Model | BJH PCB |
Ketebalan tembaga | 1 - 4oz |
Aperture minimum | 0.15mm |
Lebar baris minimum | 0.1mm |
Jarak baris minimum | 0.1mm |
Rawatan permukaan | OSP, Rendaman Emas, Tin Rendaman, Perak Rendam |
Saiz papan | OEM |
Pembukaan topeng solder minimum | 1.5 juta |
Jambatan topeng solder minimum | 3mil |
Nisbah aspek maksimum | 10:01 |
Ketepatan kawalan impedans | ± 8 % |
Lapisan maksimum | 40 |
Saiz pakej tunggal | 10x10x10cm |
Berat badan kasar | 4.000kg |
Bekalan kuasa | 9V/DC12V-24V |